1-2069364-1 datasheet

Маркировка

1-2069364-1
Производитель

TE Connectivity
Описание

TE Connectivity 1-2069364-1 Applies To: Printed Circuit Board Board-to-board Stack Height (mm [in]): 12.00 [0.472], 13.00 [0.512], 14.00 [0.551], 15.00 [0.590], 16.00 [0.630], 18.00 [0.709] Centerline (mm [in]): 0.60 [0.024] Connector Style: Receptacle Contact Base Material: Copper Alloy Contact Layout: In-Line Contact Plating, Mating Area, Material: Gold (30) Family Name: Free Height Grounding Contact: With Grounding Plate: With Industry Application: ATM Machines, Board-to-Board (Personal Systems/Computers), MFP/LBP Keyed: Yes Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Locating Post(s): With Number Of Positions: 160 Packaging Method: Soft Tray Pcb Mounting Orientation: Vertical Preloaded: Yes Product Type: Connector Region: Americas Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant
Количество страниц

3 шт.
Формат

PDF
(Для просмотра требуется Adobe Acrobat Reader)
Размер файла

526,85 KB